Last Updated： Aggregation Period:Apr 29, 2026～May 26, 2026
This ranking is based on the number of page views on our site.
1～18 item / All 18 items
Reliability born from years of experience. We provide high-quality wiring modules for keyboards with proven know-how.
【Features】 ■ Supports high switch stroke. ■ High key durability. ■ High mounting position accuracy (maximum ±0.2mm). 【Applications】 Flexible printed circuit board for switches with a click feel. *For more details, please refer to the PDF document or feel free to contact us.
Newly developed material.
◆FPC (Flexible Printed Circuit Board)◆ ~Taiyo Techno-Rex's Strengths in FPC Manufacturing Processes~ FPC manufacturing requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High precision outline processing ±50μm, diverse tools <Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Materials◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
Consistent support from development design to parts procurement, manufacturing, implementation, and assembly with short delivery times. Capable of small lot and diverse prototype and mass production.
Our company handles everything from the design to manufacturing and assembly of FPC (Flexible Printed Circuit Boards) in a one-stop service. We can flexibly respond to a wide range of needs, including prototypes and development trials, one-off and irregular orders, and mass production, all with short delivery times. Since we use sheet materials, we can produce small lots without a minimum quantity requirement. The initial lead time for mass production is at least three weeks. We thoroughly manage quality using various inspection equipment, and we have a wealth of experience in fields with particularly high quality demands, such as automotive and medical applications. 【Features】 ■ Shortened lead times for product development and reduced development costs through small-lot prototyping ■ Rapid startup during mass production and flexible responses to production lot variations ■ Comprehensive support from design to board assembly (mounting support and in-house metal mask manufacturing) ■ Support for component procurement for both prototypes and mass production ■ Proposals for appropriate methods and tools (jigs) for FPC manufacturing from production planning ★ Currently, we are offering a glossary of FPC-related terms and materials about our products. Please check it out via "PDF Download." Feel free to contact us with any inquiries.
![[Exhibition Report] We exhibited at JPCAshow 2025!](https://image.mono.ipros.com/public/product/image/91f/2001532950/IPROS2732163172441887632.png?w=280&h=280)
I would like to briefly introduce the successful exhibition content of FPC.
◎Introducing Our Company's "Strengths" in the Processing Engineering >> There are multiple important processing steps in FPC manufacturing. Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. We have introduced the "strengths" we have cultivated over many years in each process: <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Processing> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision contour processing ±50μm, a variety of tools <Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing >> Normally, there are no opportunities to see anything other than the finished product, but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. *Through-hole drilling, exposure/development, etching, contour processing, etc.
![High Current Flexible Circuit Board [*FPC Technology Catalog Available]](https://image.mono.ipros.com/public/product/image/c7d/2000477292/IPROS51770483967615096271.png?w=280&h=280)
Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.
Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
Flexible printed circuit board (FPC) for high-speed transmission
This product is an FPC designed for high-speed transmission. It uses a special liquid crystal polymer as the base film, featuring stable impedance control. We can also accommodate component mounting and procurement for FPCs, as well as supply components from customers. We offer total proposals from pattern design to mass production. We can also provide various environmental documentation. CMI is an FPC manufacturer with over 15 years of history in Taiwan. We have numerous achievements with domestic manufacturers in Japan, realizing high quality, low cost, and short delivery times based on our advanced technology and track record.
Short delivery times and small lot sizes! Supports high-quality and high-performance specifications such as high flexibility and impedance control.
Asunics collaborates with Taiwanese FPC manufacturers to provide high-quality and short-lead-time FPCs. We support high-quality and high-performance specifications such as high flexibility and impedance control. We provide speedy support from component mounting, bump and Gerber data creation assistance, to prototyping and mass production. 【Features】 ■ Materials: Polyimide / Liquid Crystal Polymer, etc. ■ High-speed signal support: LVDS / HDMI / USB / MIPI ■ Short lead time / Small lot *For more details, please download the PDF or feel free to contact us.
![Flexible printed circuit board [Reel to Reel method]](https://image.mono.ipros.com/public/product/image/4d6/2000516757/IPROS88070730930462408143.png?w=280&h=280)
We can accommodate everything from mass production to small-batch, diverse production! We contribute to the miniaturization and slimness of modules, expanding design flexibility!
We would like to introduce our "Flexible Printed Circuit Board Production." With the "Reel to Reel Method," we achieve high productivity through automation, including feeding and winding, and can produce high-quality TAB/COF using a non-contact method that minimizes human intervention. Additionally, we also conduct production in sheet form, allowing us to meet a wide range of customer demands. 【Features】 ■ Capable of producing from mass production to small quantities of various types - Supported by both reel to reel method and sheet production ■ Production of high-density fine wiring flexible substrates ■ Line/Space: Below 30μm pitch ■ VIA hole filling copper plating *For more details, please refer to the PDF document or feel free to contact us.
![[Presentation of Materials] Until FPC is completed...](https://image.mono.ipros.com/public/product/image/72b/2000645110/IPROS28517420490519986881.png?w=280&h=280)
[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!
This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Techno-Rex Co., Ltd. How are flexible printed circuit boards made? This material is intended for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The PDF version is available for download. * A PowerPoint version is also available upon request.
BigElec Fold - Customize flexible high-current wiring at a reasonable price.
BigElec Fold is a flexible and cost-effective high-current wiring solution that serves as an alternative to busbars and wire harnesses. ■ Features - Thin and flat printed circuit board structure - Customizable according to the desired shape and applied current of the customer - Two-layer construction allows for cost reduction and bending processing BigElec Fold emphasizes cost performance by limiting itself to a two-layer structure instead of a multi-layer one. This reduces material costs and makes bending processing easier, allowing for folding as well. BigElec Fold can connect to multiple terminals in its flat state, and by folding the wiring, it can also be accommodated in tight spaces. It can be freely designed and folded according to the application and wiring space. It realizes innovative ideas in the design field and provides excellent cost performance. BigElec Fold paves the way for the next stage of high-current wiring and meets customer expectations.
![[Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business -](https://image.mono.ipros.com/public/product/image/2050559/IPROS4163017014658411777.jpg?w=280&h=280)
Announcement of the "Kii Space HUB" feature and participation in "Ecosystem Link #44".
~ Taiyo TechnoRex Accelerates Its Efforts in the Space Industry ~ An interview article introducing our company's challenges in the space sector has been published on the official website of "Kii Space HUB," a space industry support project promoted by Wakayama Prefecture. ▼ https://kii-space-hub.jp/reports/action-workshop-vol1.html The article summarizes our efforts to apply the FPC technology we have cultivated over many years to the space business, as well as our learnings from entering the field and future prospects. Additionally, on February 24, 2026, our employee Akihiro Moriwaki will present on the potential of FPC for satellites at the event "Ecosystem Link #44 presented by It’s Sta." ▼ https://u-fino.com/event/list/detail/000503.html This event will be held as a gathering place for diverse players in the space industry. Our company will continue to promote the application of technology and business expansion in the space industry.
Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!
The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.
Fureki's social study trip, experience Taiyo Technorex's FPC at Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area through high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We also have live demonstrations of 'FA Automation' and 'Latest Appearance Inspection Systems using AI Technology'! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate calibration burdens and realize high-precision, high-speed operation. We have prepared a demonstration of rigid board transport and are waiting for you. ◎The latest final appearance inspection system, AI system 'TY-VISION XAIS,' has entered Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with low brightness differences that are difficult to detect by inspection devices, even though they can be identified visually.
![[Exhibition Report] We exhibited at NEPCON Japan 2026!](https://image.mono.ipros.com/public/product/image/2001604310/IPROS7821557136413432738.jpg?w=280&h=280)
Here is a brief introduction to the successful exhibition content.
<Main Exhibition Content> ◆FPC (Flexible Printed Circuit Board)◆ ~Touch, Compare, Experience FPC!~ ●Comparison of weight between rigid boards and FPC ●Reduction of board area through high-density wiring ●Improved work efficiency with transparent FPC ●Introduction of black coverlay, etc. ~Technical Topics~ ●High-frequency compatible FPC / High-frequency analysis measurement... Proposing optimal designs and materials based on analysis results ●Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring ●Pattern via fill 4-layer FPC... Achieving high-density wiring and pad-on-via ●6-layer stack via FPC... High-density wiring with stack via structure ~Our Initiatives~ ●Introduction of "Space" related business ●Demonstration of "Leak Detection Device" ◆Various Boards and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical inspection equipment (Semi-automatic appearance inspection equipment TY-VISION M105SC II) Live demonstration ◆Efficiency and Automation◆ Proposal for utilizing FA and collaborative robots (Appearance inspection system + ASSISTA = Efficiency) Live demonstration
Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.
BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.
![[Exhibition Report] We exhibited at NEPCON Japan 2025!](https://image.mono.ipros.com/public/product/image/c7a/2001510480/IPROS11956591292795024490.jpg?w=280&h=280)
Here is a brief introduction to the successful exhibition content.
<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ ~ Touch, Compare, Experience FPC! ~ ● Comparison of weight between rigid boards and FPC ● Reduction of board area through high-density wiring ● Difference in heat generation temperature due to copper thickness ● Improved work efficiency with transparent FPC, etc. ~ Technology Topics ~ ● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results ● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring ● Pattern via fill FPC... Achieving high-density wiring and pad-on-via ● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ By achieving teaching-less implementation through visual feedback control, eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ TY-VISION XAIS AI-based defect detection and false report reduction ・M111SC (manual machine) high-definition (package) board × high-resolution inspection ・M109SC (manual machine) diverse workpieces × large format
I would like to introduce the "Technical Information" related to FPC.
● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.
『FPCのお困り事、一刀両断！』太洋テクノレックスは次代のニーズを敏感にキャッチし、フレキシブルな技術力でFPCを牽引！
フレキシブルプリント配線板 高周波フッ素複合材3層FPC 誘電特性に優れたフッ素複合材FPCでノイズ対策と狭小化を両立。同軸ケーブルからの転換にも好適。 MSAP工法～超細線FPC～ めっきアップで高精度、かつ高密度の微細配線を実現。配線断面の矩形性に優れ、イメージ通りの配線形成が可能。 透明FPC 優れた光透過性と耐熱性を備えチップ実装も可能なFPC。 製品のデザインを損なうことなく配線の引き回しが可能。 6層スタックビアFPC ビアフィリング技術によるスタックビア構造で、さらなる高密度配線化を実現。配線スペースの有効活用により、設計自由度の向上に貢献。 基板検査システム【最終外観検査】 パッケージ・モジュール系基板に好適な光学分解能2.5µm仕様機が遂にラインナップ！ 虚報低減AIシステム『ザイス』と欠陥検出AIシステムの採用で最終外観検査工程の効率化を大幅にアップしました。 マテハン・協働ロボット活用で自動化・効率化を提案 協働ロボット・産業用ロボットのシステムインテグレートや周辺機器など、お客様の業種や業態に適したFAシステムをご提案致します。
